Server-grade dual-socket motherboard engineered for multi-socket compute with robust thermal and power delivery. Supports 3rd Gen Intel Xeon Scalable processors on dual LGA-4189 sockets and high-density memory configurations for large in-memory workloads. Extensive I/O includes multiple PCIe 4.0 x16 slots, dual M.2 NVMe with RAID support and integrated IPMI management for remote KVM and monitoring. Designed for rack server integration with industrial operating ranges and TPM 2.0 hardware security.
| CPU Support |
3rd Gen Intel® Xeon® Scalable processors; dual-socket support; CPU TDP up to 270W |
| Socket |
Dual LGA-4189 (Socket P+) sockets |
| Chipset |
Intel® C621A chipset |
| Memory Capacity |
Up to 4TB using 3DS ECC RDIMM / Up to 6TB Intel® Optane™ Persistent Memory (total, memory mode) |
| Memory Configuration |
16 DIMM slots; DDR4-3200MHz support; ECC RDIMM and LRDIMM compatible |
| Expansion Slots |
6 × PCIe 4.0 x16 slots and 1 × PCIe 4.0 x8 slot |
| Storage Interfaces |
2 × M.2 (PCIe 4.0 x4) supporting M.2 2242/2260/2280/22110; RAID 0 & 1 support |
| Management & Security |
Integrated BMC/IPMI with KVM-over-LAN, dedicated management LAN, TPM 2.0, SuperDoctor5, SSM/SPM/SUM software support |
| Server I/O & Cooling |
10 × 4-pin PWM fan headers, UID LED, chassis intrusion header, multi-voltage monitoring and PWM fan control |
| Operating Environment |
Operating: 50°F to 95°F (10°C to 35°C); Non-operating: -40°F to 158°F (-40°C to 70°C); Operating RH 8%–90% non-condensing |
